A cooler paint

A Cooler Raman Laser

P ower dissipation, which results in heat generation in electronic chips, is the number one difficulty facing the semiconductor industry. The problem is so severe that it threatens to halt the huge development that has been enjoyed since the microprocessor industry’s inception — a doubling in processor performance roughly every 18 months, which was predicted by the celebrated Moore’s law. And t...

The Indiana Cooler: A Retrospective

From 1983 to 2002, the Indiana Cooler was constructed and operated at the Indiana University Cyclotron Facility. During that period, a relatively small group of people built an accelerator complex, explored the new technology of electron cooling, and demonstrated its usefulness in nuclear and particle physics. This review recounts the history of the project, describes the facility, and summariz...

SiGeC Cantilever Micro Cooler

The fabrication and characterization of SiGeC cantilever microcoolers are described. Silicon on insulator (SOI) was used as the substrate, and two layers of 3 μm p-SiGe0.07C0.0075 and 1.14 μm n-SiGe0.07C0.0075 lattice matched to silicon were grown using molecular beam epitaxy. The uni couple cooler was fabricated using conventional integrated circuit (IC) processing, and the cantilever structur...

Researches on a Cooler and Cleaner Compressor

10K Pulse Tube Cooler

A 3-stage pulse tube cooler has been designed to operate at 10¶K. The staged cooler uses the same compressor and parallel staging configuration for the 1 st and 2 nd stages as previously employed for our delivered High Capacity Cryocooler (HCC). The 2 nd and 3 rd stages are in a serial configuration. The addition of the third stage extends the performance of this cooler to lower operating tempe...